公开(公告)号：US06600233B2

公开(公告)日：2003-07-29

申请号：US10142576

申请日：2002-05-08

申请人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

发明人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

IPC分类号： H01L2144

CPC分类号： H05K3/3463 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00 ,  H01L2224/0401

摘要： An integrated circuit package fabricated by attaching a surface mount pin to a pin pad on a substrate using a Sn—Sb solder composition, where the quantity of Sb is in a range from 4 percent to 10 percent by weight. The Sn—Sb composition has a melting point above the melting point of commonly-used Sn—Pb solders. Thus, after the pins are surface mounted to the substrate, the pin integrity is not later compromised by assembly steps that reheat the substrate to a temperature sufficient to reflow the Sn—Pb solder. In one embodiment, the surface mount pins are attached to the bottom surface of an organic substrate using the Sn—Sb composition, and a flip-chip is attached to the top surface using Sn—Pb solder bumps. An integrated circuit package includes the substrate, the surface mount pins, and the Sn—Sb solder composition on the bonding surfaces of the pins.

公开(公告)号：US06413849B1

公开(公告)日：2002-07-02

申请号：US09473447

申请日：1999-12-28

申请人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

发明人： Hwai-Peng Yeoh ,  Hamid Azimi ,  Amir Nur Rashid Wagiman ,  Mirng-Ji Lii

IPC分类号： H01L2144

CPC分类号： H05K3/3463 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method for attaching a surface mount pin to a pin pad on a substrate uses a Sn—Sb solder composition, where the quantity of Sb is in a range from 4 percent to 10 percent by weight. The Sn—Sb composition has a melting point above the melting point of commonly-used Sn—Pb solders. Thus, after the pins are surface mounted to the substrate, the pin integrity is not later compromised by assembly steps that reheat the substrate to a temperature sufficient to reflow the Sn—Pb solder. In one embodiment, the surface mount pins are attached to the bottom surface of an organic substrate using the Sn—Sb composition, and a flip-chip is attached to the top surface using Sn—Pb solder bumps. An integrated circuit package includes the substrate, the surface mount pins, and the Sn—Sb solder composition on the bonding surfaces of the pins.

摘要翻译： 用于将表面安装销安装到基板上的销焊盘的方法使用Sb的量在4重量％至10重量％的范围内的Sn-Sb焊料组合物。 Sn-Sb组合物的熔点高于常用Sn-Pb焊料的熔点。 因此，在将引脚表面安装到基板之后，通过将衬底重新加热到足以使Sn-Pb焊料回流的温度的组装步骤，引脚的完整性不会受到影响。 在一个实施例中，使用Sn-Sb组合物将表面安装销附接到有机基板的底表面，并且使用Sn-Pb焊料凸块将倒装芯片附接到顶表面。 集成电路封装包括在引脚的接合表面上的衬底，表面安装引脚和Sn-Sb焊料组合物。