发明授权
- 专利标题: Integrated circuit package
- 专利标题(中): 集成电路封装
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申请号: US08928826申请日: 1997-09-12
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公开(公告)号: US06603200B1公开(公告)日: 2003-08-05
- 发明人: Qwai H. Low , Chok J. Chia , Seng-Sooi (Allen) Lim
- 申请人: Qwai H. Low , Chok J. Chia , Seng-Sooi (Allen) Lim
- 主分类号: H01L23053
- IPC分类号: H01L23053
摘要:
An integrated circuit package includes a connector board and plural levels of individual conductors and conductive vias disposed through the connector board to form electrical connections between external connection pads on an undersurface of the connector board and finger connections on the upper surface of the connector board. An integrated circuit die is mounted in a central region of the connector board within confines of the individual conductors that are arranged about the die, and wire bond connections are formed between selected ones of the finger connections, the individual conductors, and the connection pads on the integrated circuit die to provide distributed connections for ground and power at one or more operating voltage levels on the individual conductors.