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    Integrated circuit package
    1.
    发明授权
    Integrated circuit package 失效
    集成电路封装

    公开(公告)号：US06603200B1

    公开(公告)日：2003-08-05

    申请号：US08928826

    申请日：1997-09-12

    申请人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi (Allen) Lim

    发明人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi (Allen) Lim

    IPC分类号： H01L23053

    CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/48227 ,  H01L2224/48233 ,  H01L2224/4911 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

    摘要： An integrated circuit package includes a connector board and plural levels of individual conductors and conductive vias disposed through the connector board to form electrical connections between external connection pads on an undersurface of the connector board and finger connections on the upper surface of the connector board. An integrated circuit die is mounted in a central region of the connector board within confines of the individual conductors that are arranged about the die, and wire bond connections are formed between selected ones of the finger connections, the individual conductors, and the connection pads on the integrated circuit die to provide distributed connections for ground and power at one or more operating voltage levels on the individual conductors.

    摘要翻译： 集成电路封装包括连接器板和多层单独的导体以及通过连接器板设置的导电通路，以在连接器板的下表面上的外部连接焊盘和连接器板的上表面上的指状连接之间形成电连接。 集成电路管芯安装在连接器板的中心区域，在围绕管芯布置的各个导体的限制范围内，并且引线接合连接形成在指状连接，各个导体和连接焊盘上的选定的导体之间 集成电路管芯，以在单个导体上的一个或多个工作电压电平上提供用于接地和电力的分布式连接。

    Multiple layer tape ball grid array package
    2.
    发明授权
    Multiple layer tape ball grid array package 有权
    多层磁带球栅阵列封装

    公开(公告)号：US06285077B1

    公开(公告)日：2001-09-04

    申请号：US09377887

    申请日：1999-08-19

    申请人： Chok J. Chia ,  Seng-Sooi Allen Lim ,  Qwai Hoong Low

    发明人： Chok J. Chia ,  Seng-Sooi Allen Lim ,  Qwai Hoong Low

    IPC分类号： H01L2348

    CPC分类号： H01L23/3128 ,  H01L23/49833 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

    摘要： A package for an integrated circuit is disclosed. The package comprises two layers (a top layer and a bottom layer) of flexible tape, each of which has a top surface and a bottom surface, with metal traces on the top surface. A die is mounted on top of the two layers and wire bonds connect bond pads on the die to metal traces on each of the two flexible tapes. The metal traces are routed along the top surfaces of the flexible tapes and are coupled to solder balls through holes in the tapes. These solder balls are mounted along the bottom of the package and serve as the electrical interface to a printed circuit board. Additional holes in the bottom layer tape allow solder balls to extend through the bottom layer tape so that they may be electrically coupled to traces on the top layer tape.

    摘要翻译： 公开了一种用于集成电路的封装。 该包装包括柔性带的两层（顶层和底层），每层具有顶表面和底表面，顶表面具有金属迹线。 模具安装在两层的顶部，引线接合将模具上的接合焊盘连接到两个柔性带中的每一个上的金属迹线。 金属迹线沿着柔性带的顶表面布线，并通过带中的孔耦合到焊球。 这些焊球沿着封装的底部安装并用作印刷电路板的电接口。 底层带中的另外的孔允许焊球延伸穿过底层带，使得它们可以电耦合到顶层带上的迹线。

    High power dissipating packages with matched heatspreader heatsink assemblies
    3.
    发明授权
    High power dissipating packages with matched heatspreader heatsink assemblies 失效
    具有匹配散热器散热器组件的大功率消散封装

    公开(公告)号：US5463529A

    公开(公告)日：1995-10-31

    申请号：US317968

    申请日：1994-10-04

    申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

    CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

    摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

    摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。

    Multiple sized die
    5.
    发明授权
    Multiple sized die 失效
    多尺寸模具

    公开(公告)号：US6040632A

    公开(公告)日：2000-03-21

    申请号：US6784

    申请日：1998-01-14

    申请人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

    发明人： Qwai H. Low ,  Chok J. Chia ,  Seng-Sooi Lim

    IPC分类号： H01L23/485 ,  H01L27/10

    CPC分类号： H01L24/02 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043

    摘要： A multiple-sized integrated circuit (IC) die and a method of making a multiple-sized IC die includes forming a plurality of IC dies on a semiconductor wafer. Each IC die has multiple rows of bonding pads around its periphery. Adjacent bonding pads on separate rows of each IC die are electrically connected together so that attachment to any one of the connected bond pads yields the same result. A plurality of scribe streets separate each IC die on the wafer, with the scribe street defining the width between each IC die. Rows of bonding pads reside in the scribe street area. Different rows of bonding pads may be selectively removed from the IC die by scribing the wafer so as to include one or more of the rows of bonding pads, thereby allowing one IC die design to have multiple sizes. An IC die separated from the wafer may still be sized smaller as long as there remain at least two rows of bonding pads around the periphery.

    摘要翻译： 多尺寸集成电路（IC）管芯和制造多尺寸IC管芯的方法包括在半导体晶片上形成多个IC管芯。 每个IC芯片周围都有多排接合焊盘。 每个IC管芯的独立行上的相邻接合焊盘电连接在一起，使得连接到任何一个连接的接合焊盘产生相同的结果。 多个划线区将晶片上的每个IC芯片分开，划线条限定每个IC芯片之间的宽度。 焊盘行位于划痕街区域。 可以通过划片晶片来选择性地从IC芯片去除不同行的焊盘，以便包括一行或多行接合焊盘，从而允许一个IC管芯设计具有多个尺寸。 只要在周围保持至少两排接合焊盘，则与晶片分离的IC裸片仍可具有更小的尺寸。

    Method of cooling a packaged electronic device
    6.
    发明授权
    Method of cooling a packaged electronic device 失效
    冷却电子装置的方法

    公开(公告)号：US5568683A

    公开(公告)日：1996-10-29

    申请号：US472320

    申请日：1995-06-07

    申请人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    发明人： Chok J. Chia ,  Manian Alagaratnam ,  Qwai H. Low ,  Seng-Sooi Lim

    IPC分类号： F02F7/00 ,  H01L23/367 ,  H01L23/40 ,  H05K3/30

    CPC分类号： H01L23/40 ,  F02F7/00 ,  H01L23/3675 ,  H01L2924/0002 ,  Y10T29/4913

    摘要： A removable heatsink assembly comprised of a heatsink unit and a heatspreader is provided. The heatsink unit has at least one fin and a coupling collar for radiating heat away from a packaged electronic device. The heatspreader includes a platform attached to an inner collar in thermal contact with the packaged electronic device. The platform has one or more tabs suitable for mating with one or more flanges located on the coupling collar of the heatsink unit. Coupling grooves within the flanges engage the platform of the heatspreader when the flanges are mated with the heatspreader tabs and the heatsink is turned. The heatsink can therefore be quickly and conveniently attached to or removed from the heatspreader. The present invention thus permits a wide variety of different heatsinks to be interchangeably used with a single heatspreader attached to an electronic device package.

    摘要翻译： 提供了由散热器单元和散热器组成的可拆卸的散热器组件。 散热器单元具有至少一个翅片和用于从封装的电子设备辐射热量的联接套环。 散热器包括附接到与封装的电子设备热接触的内部套环的平台。 该平台具有一个或多个适合于与位于散热器单元的联接环上的一个或多个凸缘相配合的凸片。 当凸缘与散热片接头配合并且散热片转动时，凸缘内的耦合凹槽接合散热器的平台。 因此，散热器可以快速方便地附接到散热器或从散热器移除。 因此，本发明允许各种不同的散热器与附接到电子设备封装的单个散热器可互换地使用。

    Bonding pad isolation
    9.
    发明授权
    Bonding pad isolation 有权
    粘接垫隔离

    公开(公告)号：US06743979B1

    公开(公告)日：2004-06-01

    申请号：US10652453

    申请日：2003-08-29

    申请人： Michael J. Berman ,  Aftab Ahmad ,  Qwai H. Low ,  Chok J. Chia ,  Ramaswamy Ranganathan

    发明人： Michael J. Berman ,  Aftab Ahmad ,  Qwai H. Low ,  Chok J. Chia ,  Ramaswamy Ranganathan

    IPC分类号： H05K506

    CPC分类号： H01L24/06 ,  H01L24/05 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49431 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

    摘要： An integrated circuit, including a substrate with circuitry formed therein, where the substrate has a peripheral edge. Also included are a top most electrically conductive layer and an underlying electrically conductive layer. Outer bonding pads are disposed in an outer ring, and are formed within the top most layer. Inner bonding pads are disposed in an inner ring, and are formed within the top most layer. Inner connectors electrically connect the inner bonding pads to the circuitry. The inner connectors are formed within the underlying layer, and have a width that is less than the width of the inner bonding pads, thereby defining a gap between the inner connectors. Outer connectors electrically connect the outer bonding pads to the circuitry. The outer connectors are formed within the underlying layer, and have a width that is less than the width of the gap between the inner connectors.

    摘要翻译： 一种集成电路，包括其中形成有电路的衬底，其中衬底具有外围边缘。 还包括最顶层的导电层和底层导电层。 外部接合焊盘设置在外圈中，并形成在最上层。 内部接合焊盘设置在内圈中，并且形成在最顶层内。 内部连接器将内部接合焊盘电连接到电路。 内部连接器形成在下面的层中，并且具有小于内部焊盘的宽度的宽度，由此限定内部连接器之间的间隙。 外部连接器将外部接合焊盘电连接到电路。 外部连接器形成在下面的层中，并且具有小于内部连接器之间的间隙的宽度的宽度。