- 专利标题: Structure for an electrical contact to a thin film in a semiconductor structure and method for making the same
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申请号: US09858121申请日: 2001-05-15
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公开(公告)号: US06605532B1公开(公告)日: 2003-08-12
- 发明人: Kunal R. Parekh , Mark Fischer , Charles H. Dennison
- 申请人: Kunal R. Parekh , Mark Fischer , Charles H. Dennison
- 主分类号: H01L214763
- IPC分类号: H01L214763
摘要:
A network of electrically conductive plate contacts is provided within the structure of a DRAM chip to enable storage of non-zero voltage levels in each charge storage region. An improved cell or top plate contact provides low contact resistance and improved structural integrity making the contact less prone to removal during subsequent processing steps. A top plate conformally lines a container patterned down into a subregion. A metal contact structure comprises a waist section, a contact leg, and an anchor leg. The contact leg makes contact to the top plate within the container interior. The waist section joins the top of the contact leg to the top of the anchor leg and extends over the edge of the top plate. The anchor leg extends downward through the subregion adjacent to but spaced from the container to anchor the structure in place and provide structural integrity. Accordingly, the present invention provides an improved structure for contact to a conductive thin film, having low contact resistance and an improved structural integrity.
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