A granular semiconductor material transport system capable of continuous, non-contaminating transfer of granular semiconductor material from a large source vessel to a smaller and more manageable target vessel. Movement of the granular material is induced by flowing transfer fluid. The system includes a source vessel, a feed tube, a process vessel, a target vessel and a vacuum source, or mover. The source vessel contains a bulk supply of granular material to be transported. A feed tube received within the source vessel transfers the granular material entrained in a transfer fluid from the source vessel to the process vessel. The process vessel separates the granular material from any dust particles and deposits the granular material in the more manageable target vessel. The vacuum source sealably connects to the process vessel to evacuate the process vessel to set the granular polysilicon in motion within the system.