A resin composition comprising: a polyimide comprising a recurring unit represented by the following formula (1):  wherein Ar0 is an aromatic hydrocarbon group having 6 to 15 carbon atoms, and R1 is at least one group selected from the group consisting of the divalent residual group obtained by removing two amino groups from an aliphatic diamine having 2 to 30 carbon atoms and the divalent residual group obtained by removing two amino groups from an alicyclic diamine having 4 to 30 carbon atoms, and a polyarylate or polyester carbonate. This resin composition has excellent heat resistance, dimensional stability and transparency. Particularly, the resin composition having excellent transparency is advantageously used as a molded product such as a flexible printed board.