发明授权
- 专利标题: Laser etching method
- 专利标题(中): 激光蚀刻法
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申请号: US08391745申请日: 1995-02-21
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公开(公告)号: US06617541B1公开(公告)日: 2003-09-09
- 发明人: Sipke Wadman , Klaus B. Schildbach
- 申请人: Sipke Wadman , Klaus B. Schildbach
- 优先权: EP94200436 19940222
- 主分类号: B23K2638
- IPC分类号: B23K2638
摘要:
A method of furnishing a substrate with a patterned film of electrode material making use of a laser beam, whereby a stack is made by providing a surface of the substrate at least with a layer of an assistant material and an overlying layer of the said electrode material, the assistant material being capable of decomposition upon heating with the aid of the said laser beam, subsequent to which the stack is, in accordance with a desired pattern, locally irradiated with the laser beam so as to heat the assistant material to at least its decomposition temperature, consequent upon which the locally overlying electrode material is caused to detach.
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