Lands for mounting are located on the upper and lower surfaces of a substrate. External electrodes are exposed at a rear surface of a package body. An IC package is mounted by bonding the lands for mounting to the external electrodes. Lands for external connection are connected to the lands for mounting. The lands for external connection are located outside of the IC package. Solder bumps are connected to one side of the lands for external mounting. Thus, a semiconductor device for a semiconductor module is provided.