An opto-electric module for connection with a printed circuit board having a through-hole comprising: (1) a substrate; (2) an opto-electric device electrically connected to the substrate; and (3) a compliant pin coupled to the opto-electric device and extending from the substrate for electrically connecting the through-hole of the printed circuit board with the opto-electric device. The compliant pin enables the opto-electric module to be electrically coupled to the printed circuit board in a one-step process without exposing the opto-electric device to potentially damaging temperatures associated with soldering.