An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.