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公开(公告)号：US06467120B1
公开(公告)日：2002-10-22
申请号：US09391439
申请日：1999-09-08
IPC分类号： B08B1100
CPC分类号： H01L21/67046 , B08B1/04
摘要： A wafer cleaning brush roller having uniform and non-uniform protrusions via compression. The protrusions are formed by an inner PVA sponge compressed through an outer sleeve formed of a resilient mesh that does not react with DI water or other CMP surfactants. Directional channeling of DI water is also provided to the protrusions. Edge cleaning of the wafer as accomplished by having a thicker brush extension at each end where the wafer's edge would rub and provide added cleaning capability.
摘要翻译： 具有通过压缩的均匀和不均匀突起的晶片清洁刷辊。 突起由通过由不与DI水或其它CMP表面活性剂反应的弹性网形成的外套筒压缩的内PVA海绵形成。 去离子水的定向通道也提供给突起。 通过在晶片的边缘摩擦并提供增加的清洁能力的每个端部处具有较厚的刷子延伸来实现晶片的边缘清洁。
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公开(公告)号：US06837777B2
公开(公告)日：2005-01-04
申请号：US10610098
申请日：2003-06-30
CPC分类号： H01L21/02052 , B08B1/04 , B24B9/065 , H01L21/67046
摘要： An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.
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3.发明授权Apparatus and method for front side chemical mechanical planarization (CMP) of semiconductor workpieces 有权半导体工件的前侧化学机械平面化（CMP）的装置和方法公开(公告)号：US06620029B2
公开(公告)日：2003-09-16
申请号：US10059775
申请日：2002-01-30
IPC分类号： B24B100
摘要： An apparatus for performing semiconductor planarizing operations is disclosed. In an exemplary embodiment, the apparatus includes a carrier assembly for maintaining a workpiece therein in a face up orientation. A roller assembly includes a first cylindrical roller and a cylindrical second roller, the first and second rollers being linked to one another through a pair of arms. Each of the first and second rollers may be independently positioned with respect to a horizontal plane, the horizontal plane being substantially parallel to a top surface of the workpiece.
摘要翻译： 公开了一种用于执行半导体平面化操作的装置。 在示例性实施例中，该装置包括用于以面朝上的方向将工件保持在其中的托架组件。 辊组件包括第一圆柱形辊和圆柱形第二辊，第一和第二辊通过一对臂相互连接。 第一和第二辊中的每一个可以相对于水平面独立地定位，水平面基本上平行于工件的顶表面。
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4.发明授权Real-time method for profiling and conditioning chemical-mechanical polishing pads 失效化学机械抛光垫成型和调理的实时方法公开(公告)号：US06343974B1
公开(公告)日：2002-02-05
申请号：US09603684
申请日：2000-06-26
IPC分类号： B24B4900
CPC分类号： B24B53/017 , B24B49/10 , B24B53/12
摘要： A conditioning tool including a rotary conditioning pad; a lower shaft attached to the conditioning pad; an upper shaft having an upper end and a lower end, the lower end attached to the lower shaft via a flexible coupling; and a motor attached to the upper end of the upper shaft and adapted to rotate the shaft. The tool further includes a mechanism for measuring an angle of the conditioning pad relative to a reference plane. The conditioning tool may further include a conditioning arm, various control mechanisms, and a controller for receiving feedback from the angle measuring mechanism and the various control mechanisms and for controlling the various control mechanisms in response to the feedback. A chemical-mechanical polishing apparatus and a conditioning method for providing a uniform polishing surface of a chemical-mechanical polishing pad are also disclosed.
摘要翻译： 一种调节工具，包括旋转调节垫; 连接到调节垫的下轴; 具有上端和下端的上轴，所述下端通过柔性连接件附接到所述下轴; 以及安装在上轴的上端并适于旋转轴的马达。 该工具还包括用于测量调节垫相对于参考平面的角度的机构。 调节工具还可以包括调节臂，各种控制机构和用于从角度测量机构和各种控制机构接收反馈的控制器，并且用于响应于反馈来控制各种控制机构。 还公开了一种化学机械抛光装置和用于提供化学机械抛光垫的均匀抛光表面的调节方法。
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公开(公告)号：US06622334B1
公开(公告)日：2003-09-23
申请号：US09537206
申请日：2000-03-29
IPC分类号： B01B1102
CPC分类号： H01L21/02052 , B08B1/04 , B24B9/065 , H01L21/67046
摘要： An improvement is disclosed in a brush cleaning apparatus for cleaning a major surface of a wafer and including wafer guide wheels for transporting the wafer. The improvement includes a polish pad material disposed on a circumference of the guide wheels. The polish pad material is a material used in chemical-mechanical polishing of the wafer. The polish pad material contacts an edge portion of the wafer during cleaning thereof, thereby removing contaminants from the edge portion of the wafer, so that edge cleaning is performed in situ in addition to the brush cleaning of the major surface of the wafer.
摘要翻译： 在用于清洁晶片的主表面并且包括用于输送晶片的晶片导向轮的刷清洁装置中公开了一种改进。 该改进包括设置在导轮的圆周上的抛光垫材料。 抛光垫材料是用于晶片化学机械抛光的材料。 抛光垫材料在其清洁期间接触晶片的边缘部分，从而从晶片的边缘部分去除污染物，使得边缘清洁除了对晶片的主表面的刷清洁之外进行。
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公开(公告)号：US06334230B1
公开(公告)日：2002-01-01
申请号：US09758989
申请日：2001-01-12
IPC分类号： B08B1102
CPC分类号： H01L21/67046 , B08B1/04
摘要： A wafer cleaning apparatus includes a wafer holding mechanism and a wafer cleaning head; the mechanism contacts the outer edge of the wafer and has a surface substantially flush with the wafer surface. The wafer cleaning head includes a wafer cleaning element, which has a flat surface contacting the wafer surface when cleaning the wafer. The wafer cleaning element may be a brush, a sponge, or other suitable material. A portion of the wafer cleaning element overlies the above-mentioned surface of the wafer holding mechanism when cleaning the edge portion of the wafer. The wafer holding mechanism and wafer cleaning head are shaped to avoid mechanical interference therebetween when the edge portion of the wafer is cleaned. Accordingly, the entire wafer surface, including the area adjacent the edge, may be effectively cleaned.
摘要翻译： 晶片清洗装置包括晶片保持机构和晶圆清洗头; 该机构接触晶片的外边缘并具有与晶片表面基本齐平的表面。 晶片清洁头包括晶片清洁元件，其在清洁晶片时具有与晶片表面接触的平坦表面。 晶片清洁元件可以是刷子，海绵或其它合适的材料。 当清洁晶片的边缘部分时，晶片清洁元件的一部分覆盖晶片保持机构的上述表面。 当清洁晶片的边缘部分时，晶片保持机构和晶片清洁头被成形为避免它们之间的机械干涉。 因此，可以有效地清洁包括邻近边缘的区域的整个晶片表面。
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7.发明授权公开(公告)号：US06227948B1
公开(公告)日：2001-05-08
申请号：US09532170
申请日：2000-03-21
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24D9/08
摘要： A method of reconditioning a polishing pad using a chemical-mechanical polishing apparatus is disclosed, wherein the polishing pad contacts a workpiece in the presence of a slurry to perform chemical-mechanical polishing on the workpiece. The method comprises contacting the polishing pad with a reconditioning pad. The reconditioning pad is made of a polishing pad material similar to that of the polishing pad.
摘要翻译： 公开了一种使用化学机械抛光装置来修复抛光垫的方法，其中抛光垫在浆料存在下接触工件以在工件上进行化学机械抛光。 该方法包括使抛光垫与修复垫接触。 再生垫由与抛光垫类似的抛光垫材料制成。
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公开(公告)号：US06217422B1
公开(公告)日：2001-04-17
申请号：US09233886
申请日：1999-01-20
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/04
摘要： A method and apparatus for cleaning polishing debris from the surface of a polishing pad by wetting the surface with a liquid and irradiating the wetted surface with a beam of light. The light beam has sufficient intensity at the polishing surface of the pad to vaporize at least a portion of the liquid such that the vaporized liquid causes at least a portion of the debris to be expelled from the polishing surface of the pad.
摘要翻译： 一种用于通过用液体润湿表面并用光束照射润湿表面来从抛光垫的表面清洁抛光碎屑的方法和装置。 光束在衬垫的抛光表面具有足够的强度以使至少一部分液体蒸发，使得蒸发的液体使至少一部分碎屑从衬垫的抛光表面排出。
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