发明授权
US06624018B1 Method of fabricating a DRAM device featuring alternate fin type capacitor structures 有权
制造具有交替鳍式电容器结构的DRAM器件的方法

Method of fabricating a DRAM device featuring alternate fin type capacitor structures
摘要:
A process for fabricating an alternate fin type capacitor structure, used to increase capacitor surface area has been developed. The process features the formation of fin shaped, storage node structures, located in fin type capacitor openings, which are in turn defined in a group of composite insulator layers. A first fin type capacitor opening is formed by selectively creating lateral recesses in first type insulator layers, exposed in a first capacitor opening in the composite insulator layers, while an adjacent, second fin type capacitor opening is formed by selectively creating lateral recesses in second type insulator components, exposed in a second capacitor opening located in the same composite insulator layers. Portions of the lateral recesses in the first and second fin type capacitor openings overlay, allowing intertwined or alternate, storage node structures to be realized, thus reducing the space needed for the capacitor structure. The horizontal features of the fin shaped storage node structure, located in the lateral recesses, result in increased capacitor surface area when compared to counterparts fabricated without the lateral recess component.
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