A collapsible chip conveyer includes a conveying member having a forwarding portion and a return portion. The conveying member receives chips discharged from a machining tool at a receiving position set on the forwarding portion, conveys the chips to a discharge position, which is located on the forward portion and spaced from the receiving position by a predetermined distance, and discharges the chips from the discharge position. The conveying member has a guide rail, a frame, and a hinge mechanism. Also, the conveying member includes a plurality of separation portions, each of which includes a part of the guide rail and a part of the frame. The hinge mechanism has a rotation axis, which is located between the forwarding portion and the return portion, and couples the separation portions such that the separation portions pivots about the rotation axis between a collapsed position and an opened position. When at the opened position, the separation portions contact each other at one side of the hinge mechanism while forming a gap at the other side. A cover is detachably mounted on the frame to cover the gap. The cover is disengaged from the gap when the separation portion are in a collapsed position.