发明授权
US06629881B1 Method and apparatus for controlling slurry delivery during polishing
失效
用于在抛光期间控制浆料输送的方法和装置
- 专利标题: Method and apparatus for controlling slurry delivery during polishing
- 专利标题(中): 用于在抛光期间控制浆料输送的方法和装置
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申请号: US09505902申请日: 2000-02-17
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公开(公告)号: US06629881B1公开(公告)日: 2003-10-07
- 发明人: Fred C. Redeker , Rajeev Bajaj , Frank A. Bose , A. Jason Whitby
- 申请人: Fred C. Redeker , Rajeev Bajaj , Frank A. Bose , A. Jason Whitby
- 主分类号: B24B5700
- IPC分类号: B24B5700
摘要:
A fluid delivery apparatus and method for use in a chemical mechanical polishing system is provided. The delivery rate of a fluid onto a pad is controlled to reduce the consumption of the fluid. In general, the fluid flow may be varied between a relatively lower flow rate and a relatively higher flow rate or, alternatively, the flow may be periodically terminated. Fluid flow may be controlled by any combination of pumps, controllers, valves, or other regulator/fluid flow control member.