- 专利标题: Precise polishing apparatus and method
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申请号: US09970302申请日: 2001-10-04
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公开(公告)号: US06629882B2公开(公告)日: 2003-10-07
- 发明人: Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
- 申请人: Kazuo Takahashi , Mikichi Ban , Matsuomi Nishimura , Shinzo Uchiyama , Takashi Kamono
- 优先权: JP9-068150 19970321; JP10-066855 19980317
- 主分类号: B24B2900
- IPC分类号: B24B2900
摘要:
The present invention provides a precise polishing apparatus and method in which a polished body is polished by rotating a polishing pad having a diameter greater than that of the polished body while urging the polishing pad against the polished body in conditions that a center of the polished body is deviated from a rotation axis of the polishing pad and that the polishing pad is contacted with the entire polished surface of the polished body. The polished body may be a semi-conductor wafer.
公开/授权文献
- US20020019204A1 Precise polishing apparatus and method 公开/授权日:2002-02-14