Invention Grant
- Patent Title: Low friction slip assembly
- Patent Title (中): 低摩擦滑动组件
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Application No.: US09973282Application Date: 2001-10-09
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Publication No.: US06631792B2Publication Date: 2003-10-14
- Inventor: David A. Buck
- Applicant: David A. Buck
- Main IPC: B65H5910
- IPC: B65H5910

Abstract:
An improved slip assembly having a base and at least two opposing slip frames positioned on the base with each of the slip frames including a planar slip surface. Additionally, a die is carrier positioned within each of the slip frames and each of the die carriers also includes a planar surface which engages the slip surfaces of the slip frames. The improved slip assembly also includes a low friction slip assembly having a base and at least two opposing slip frames positioned on the base. Each of the slip frames will include a slip surface having an effective coefficient of friction less than about 0.07 and die carriers will be position within each of the slip frames.
Public/Granted literature
- US20030066717A1 Low friction slip assembly Public/Granted day:2003-04-10
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