发明授权
- 专利标题： Optical monitoring in a two-step chemical mechanical polishing process
- 专利标题（中）： 光学监测在两步化学机械抛光过程中
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申请号： US10339959申请日： 2003-01-10
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公开(公告)号： US06632124B2公开(公告)日： 2003-10-14
- 发明人: Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
- 申请人： Bret W. Adams , Boguslaw A. Swedek , Rajeev Bajaj , Savitha Nanjangud , Andreas Norbert Wiswesser , Stan D. Tsai , David A. Chan , Fred C. Redeker , Manoocher Birang
- 主分类号： B24B100
- IPC分类号： B24B100
摘要：
An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
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