Invention Grant
- Patent Title: Thin film crystal growth by laser annealing
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Application No.: US10213698Application Date: 2002-08-06
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Publication No.: US06635932B2Publication Date: 2003-10-21
- Inventor: Costas P. Grigoropoulos , Mutsuko Hatano , Ming-Hong Lee , Seung-Jae Moon
- Applicant: Costas P. Grigoropoulos , Mutsuko Hatano , Ming-Hong Lee , Seung-Jae Moon
- Main IPC: H01L2362
- IPC: H01L2362

Abstract:
A layer of material is transformed from a first state to a second state by the application of energy from an energy beam. For example, large direction- and location-controlled p-Si grain growth utilizes recrystallization of amorphous silicon from superpositioned laser irradiation. The superpositioned laser irradiation controls cooling and solidification processes that determine the resulting crystal structure. Specifically, a first laser beam of a first pulse duration is used to melt an amorphous silicon (a-Si) film and to create a temperature gradient. After an initial delay, a second laser beam with shorter pulse duration is superpositioned with the first laser beam. When a-Si is irradiated by the second laser beam, the area heated by the first laser beam becomes completely molten. Spontaneous nucleation is initiated in the supercooled liquid-Si when the liquid-Si temperature drops below the nucleation temperature. However, the central part of the liquid pool subjected to continued heating by the first laser beam cools down slowly. Grains nucleated in the periphery of the fully molten spot can therefore grow into the liquid-Si and extend in length until they collide at the center of the first laser beam spot. The first laser beam prolongs the molten Si phase and induces grain growth in a certain direction. The second laser beam triggers nucleation and controls grain location leading to subsequent lateral grain growth.
Public/Granted literature
- US20030003636A1 Thin film crystal growth by laser annealing Public/Granted day:2003-01-02
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