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US06638445B2 Silicon dioxide etch process which protects metals 有权
保护金属的二氧化硅蚀刻工艺

Silicon dioxide etch process which protects metals
摘要:
The present invention is directed to a novel etching process for a semiconductor material which inhibits corrosion of metal comprised of pretreating the material, preferably with a surfactant, and then exposing the material to a mixture comprising salt, a buffered oxide etch, and optionally a surfactant.
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