发明授权
US06640423B1 Apparatus and method for the placement and bonding of a die on a substrate
失效
用于在基板上放置和接合管芯的装置和方法
- 专利标题： Apparatus and method for the placement and bonding of a die on a substrate
- 专利标题（中）： 用于在基板上放置和接合管芯的装置和方法
-
申请号： US09618324申请日： 2000-07-18
-
公开(公告)号： US06640423B1公开(公告)日： 2003-11-04
- 发明人: Edwin F. Johnson , Gerd R. Ley , Douglas G. Lockie , Clifford A. Mohwinkel
- 申请人： Edwin F. Johnson , Gerd R. Ley , Douglas G. Lockie , Clifford A. Mohwinkel
- 主分类号： B23P1900
- IPC分类号： B23P1900
摘要：
An improved apparatus and method for the placement and bonding of a die on a substrate includes a movable die holder, a movable substrate holder, a pivoting transfer arm that picks a die from the movable die holder and transfers the die to a position adjacent the movable substrate holder, and a bondhead assembly for picking the die from the transfer arm and then bonding the die to the substrate.