发明授权
- 专利标题: Method and apparatus for placing solder balls on a substrate
- 专利标题(中): 将焊球放置在基板上的方法和装置
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申请号: US09253150申请日: 1999-02-19
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公开(公告)号: US06641030B1公开(公告)日: 2003-11-04
- 发明人: Gary Freeman , Thomas Nowak, Jr. , Thomas Purcell , A. Jason Mirabito , Thomas M. Sullivan , Richard F. Foulke , Richard F. Foulke, Jr. , Cord W. Ohlenbusch
- 申请人: Gary Freeman , Thomas Nowak, Jr. , Thomas Purcell , A. Jason Mirabito , Thomas M. Sullivan , Richard F. Foulke , Richard F. Foulke, Jr. , Cord W. Ohlenbusch
- 主分类号: B23K3512
- IPC分类号: B23K3512
摘要:
An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.
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