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公开(公告)号：US06690993B2
公开(公告)日：2004-02-10
申请号：US09892945
申请日：2001-06-27
IPC分类号： G06F700
CPC分类号： G03F7/70741 , G03F7/70866 , G03F7/70916 , Y10S414/137 , Y10S414/138 , Y10S414/139
摘要： A reticle storage system includes a reticle rack having a series of lateral slots, each for storing a reticle. Access to the reticles is provided on a lateral side of the rack. The enclosure has a series of doors for providing access to the reticles in the slots. An air circulation system flows filtered air past the reticles in the rack to prevent contaminants from accumulating on the reticles. The air circulation system is capable of providing positive air pressure within the enclosure with one door open, thereby preventing contaminants from entering the enclosure through the open door.
摘要翻译： 光罩存储系统包括具有一系列横向狭槽的光罩架，每个横向狭槽用于存储光罩。 在机架的侧面设有对掩模版的访问。 外壳具有一系列门，用于提供对插槽中的光罩的访问。 空气循环系统将过滤的空气流过机架中的光罩，以防止污染物积聚在标线上。 空气循环系统能够在一个门打开的情况下在外壳内提供正气压，从而防止污染物通过打开的门进入外壳。
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公开(公告)号：US06170737B2
公开(公告)日：2001-01-09
申请号：US09090120
申请日：1998-06-04
IPC分类号： B23K3512
CPC分类号： H01L21/67138 , B23K3/0623 , B23K3/0676 , B23K2101/40 , H01L21/4853 , H05K3/3478
摘要： An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.
摘要翻译： 用于将焊球阵列放置在衬底上的装置包括具有贯穿其中的孔阵列的载体板。 每个孔都能拿着一个焊球。 具有销排列的球放置头与由载板保持的期望的焊球图形对准。 引脚阵列将焊球的图案通过载体板中的孔推到基板上。
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公开(公告)号：US06641030B1
公开(公告)日：2003-11-04
申请号：US09253150
申请日：1999-02-19
申请人： Gary Freeman , Thomas Nowak, Jr. , Thomas Purcell , A. Jason Mirabito , Thomas M. Sullivan , Richard F. Foulke , Richard F. Foulke, Jr. , Cord W. Ohlenbusch
发明人： Gary Freeman , Thomas Nowak, Jr. , Thomas Purcell , A. Jason Mirabito , Thomas M. Sullivan , Richard F. Foulke , Richard F. Foulke, Jr. , Cord W. Ohlenbusch
IPC分类号： B23K3512
CPC分类号： H01L21/4853 , B23K3/0623 , B23K2101/36 , B23K2101/40 , H05K3/3478
摘要： An apparatus for placing spheres at predetermined positions on a substrate. The apparatus includes a platform to support the substrate at a first sphere placement position in the apparatus, and a placement station disposed above the platform that places spheres at locations on the substrate. The placement station includes a first container having a chamber to contain spheres, and a first carrier tray having a substantially horizontal upper surface that forms a lower surface of the chamber. The upper surface has a first section and a second section, the second section having a plurality of holes formed therein to receive spheres. The first carrier tray is movable to position the second section between a fill position beneath the first container and a place position disposed over the first sphere placement position. The placement station is constructed and arranged to fill the plurality of holes with spheres when the second section is in the fill position, and place the spheres at the predetermined positions on the substrate when the second section is in the place position.
摘要翻译： 一种用于将球体放置在基板上的预定位置的装置。 该装置包括平台，用于在设备中的第一球体放置位置处支撑衬底;以及放置台，设置在平台上方，将球体放置在衬底上的位置。 放置站包括具有容纳球体的腔室的第一容器和具有形成腔室的下表面的基本上水平的上表面的第一托架托盘。 上表面具有第一部分和第二部分，第二部分具有形成在其中的多个孔以接收球体。 第一承载托盘可移动以将第二部分定位在第一容器下方的填充位置和设置在第一球体放置位置之上的位置。 放置台被构造和布置成当第二部分处于填充位置时用球体填充多个孔，并且当第二部分处于位置位置时，将球体放置在基板上的预定位置。
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公开(公告)号：US06427903B1
公开(公告)日：2002-08-06
申请号：US08795543
申请日：1997-02-06
IPC分类号： B23K3512
CPC分类号： H01L21/67138 , B23K3/0623 , B23K3/0676 , B23K2101/40 , H01L21/4853 , H05K3/3478
摘要： An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate.
摘要翻译： 用于将焊球阵列放置在衬底上的装置包括具有贯穿其中的孔阵列的载体板。 每个孔都能拿着一个焊球。 具有销排列的球放置头与由载板保持的期望的焊球图形对准。 引脚阵列将焊球的图案通过载体板中的孔推到基板上。
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公开(公告)号：US6056190A
公开(公告)日：2000-05-02
申请号：US116012
申请日：1998-07-15
IPC分类号： B23K1/00 , B23K3/06 , B23K35/14 , B23K101/40 , H01L21/00 , H01L21/48 , H01L21/50 , H01L21/60 , H01L23/12 , H05K3/34 , B23K35/12
CPC分类号： H01L21/4853 , B23K3/0623 , B23K3/0676 , H01L21/67138 , B23K2201/40 , H05K3/3478
摘要： An apparatus for placing an array of solder balls on a substrate includes a carrier plate having an array of holes therethrough. Each hole is capable of holding a solder ball. A ball placement head having an array of pins is aligned with a desired pattern of solder balls held by the carrier plate. The array of pins push the pattern of solder balls through the holes in the carrier plate onto the substrate. The invention is also directed to a solder ball dispenser for dispensing solder balls to a plate having an upper surface with an array of holes formed therein. The solder ball dispenser includes a plate support to support the plate such that the upper surface is tilted at an angle from horizontal, a ball feed device to provide solder balls to the plate, and a solder ball retainer. The solder ball retainer is movable across the upper surface of the plate for controlling a speed at which the solder balls move across the plate.
摘要翻译： 用于将焊球阵列放置在衬底上的装置包括具有贯穿其中的孔阵列的载体板。 每个孔都能拿着一个焊球。 具有销排列的球放置头与由载板保持的期望的焊球图形对准。 引脚阵列将焊球的图案通过载体板中的孔推到基板上。 本发明还涉及一种焊球分配器，用于将焊球分配到具有形成在其中的孔阵列的上表面的板。 焊球分配器包括板支撑件，以支撑板，使得上表面与水平方向倾斜一角度，球供给装置向板提供焊球，以及焊球保持器。 焊球保持器可移动穿过板的上表面，用于控制焊球移动穿过板的速度。
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公开(公告)号：US4699556A
公开(公告)日：1987-10-13
申请号：US611419
申请日：1984-05-17
申请人： Richard F. Foulke
发明人： Richard F. Foulke
IPC分类号： B65G47/52 , H01L21/67 , H01L21/677 , B65G65/00
CPC分类号： H01L21/67706 , H01L21/67712 , Y10S414/138 , Y10T74/18832 , Y10T74/18968
摘要： Apparatus for transporting flat objects having first and second faces between a first carrier and a second carrier, the apparatus comprising a mechanism for supporting the first and second carriers, a pickup mechanism for picking up the objects and transporting the objects between the first carrier and the second carrier, and intermediate station having a mechanism for receiving the objects from the pickup mechanism with the faces in a first orientation and for changing the orientation of the faces before the objects are removed by the pickup mechanism.
摘要翻译： 用于在第一载体和第二载体之间输送具有第一和第二表面的扁平物体的装置，所述装置包括用于支撑第一和第二载体的机构，用于拾取物体并在第一载体和第二载体之间运送物体的拾取机构 第二载体和中间站，具有用于从第一取向的面接收来自拾取机构的物体的机构，并且用于在通过拾取机构移除物体之前改变面部的取向。
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公开(公告)号：US3938722A
公开(公告)日：1976-02-17
申请号：US355889
申请日：1973-04-30
CPC分类号： H01L21/67144 , B23K20/106
摘要： An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.
摘要翻译： 一种用于将光束引线器件和倒装芯片器件接合到衬底或其他表面上的匹配导电表面上并用于将电引线接合到半导体器件，并且随后使用热压或超声波能量匹配衬底或其它表面上的导电表面的设备。 本公开的接合系统包括具有微小的球形接合表面的新颖的接合工具，其由新颖的枢转机构引起，以便以复杂的摆动运动单独且连续地接合多个电引线，这允许接合表面跟踪 围绕设备周边的可调节的矩形或其它预定的线性路径。 该系统还包括为该装置开发的调频超声波发生器和新颖的引线复合材料。
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公开(公告)号：US4682928A
公开(公告)日：1987-07-28
申请号：US667550
申请日：1984-11-02
申请人： Richard F. Foulke , Steven M. Lord
发明人： Richard F. Foulke , Steven M. Lord
IPC分类号： B65G47/91 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/683 , B65G65/00
CPC分类号： H01L21/67781 , B65G47/912 , H01L21/67778 , H01L21/681 , H01L21/6838 , H01L21/67259 , Y10S294/907 , Y10S414/135 , Y10S414/138 , Y10S414/141
摘要： Wafer transfer apparatus including a wafer-pickup element having suction openings closer to the edge of wafer than the wafer's center so that the wafer can be picked up with greater certainty as to the locations of the wafer edges, the pickup element being thin and made of a structural layer of rigid structural material having grooves and a TEFLON layer laminated to the structural layer and having suction openings, the grooves and covering portions of TEFLON defining vacuum passages.
摘要翻译： 晶片传送装置包括具有比晶片中心更靠近晶片边缘的吸入开口的晶片拾取元件，使得可以更确定地拾取晶片，晶片边缘的位置，拾取元件较薄并且由 刚性结构材料的结构层具有凹槽和TEFLON层，层压到结构层并具有抽吸开口，TEFLON的凹槽和覆盖部分限定了真空通道。
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公开(公告)号：US4603897A
公开(公告)日：1986-08-05
申请号：US496460
申请日：1983-05-20
IPC分类号： G05D3/12 , H01L21/67 , H01L21/677 , H01L21/683 , H01L23/00 , B65G17/32
CPC分类号： H01L21/67712 , H01L21/6838 , H01L23/564 , H01L2924/0002 , Y10S294/907 , Y10S414/138 , Y10S414/141
摘要： Apparatus that uses a suction engagement element to transport semiconductor wafers between processing boats and detects when suction engagement has not occurred despite the engagement element having been moved toward a wafer a distance sufficient to enable said engagement, and then adjusts the position of the engagement element relative to the object (e.g., by backing up and trying again or by pivoting the engagement element) to facilitate the suction engagement.
摘要翻译： 使用吸引接合元件在处理船之间输送半导体晶片的装置，并且检测何时没有发生吸合接合，尽管接合元件已经朝向晶片移动足够的距离以使得能够进行接合，然后调整接合元件相对位置 （例如，通过备份并再次尝试或通过枢转接合元件）以便于吸入接合。
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公开(公告)号：US4601521A
公开(公告)日：1986-07-22
申请号：US611418
申请日：1984-05-17
申请人： Richard F. Foulke
发明人： Richard F. Foulke
IPC分类号： F16C29/04 , B23Q7/00 , F16C29/00 , H01L21/677
CPC分类号： H01L21/67706 , H01L21/67712 , Y10T16/3813
摘要： Rolling apparatus comprising a support member, first bearing means connected to the support member for rotating relative to the support member, and a first tire of material softer than the bearing means mounted on the circumference of the bearing means, the tire having a circumference that increases from a smaller diameter side to a larger diameter side and a lip extending radially inward over a portion of the bearing means on the larger diameter side of the tire, whereby the lip is biased against the bearing means as the tire travels, and is prevented from moving off the bearing means at either side.
摘要翻译： 滚动装置包括支撑构件，连接到支撑构件以相对于支撑构件旋转的第一轴承装置和比安装在轴承装置的圆周上的轴承装置更软的材料的第一轮胎，轮胎具有增加的周长 从较小直径侧到较大直径侧，以及在轮胎的较大直径侧的轴承装置的一部分上径向向内延伸的唇缘，由此当轮胎行进时，唇缘被偏压抵靠轴承装置，并且被防止 在任一侧移动轴承装置。
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