A high pressure, lamp may be made in a pressure vessel by using an induction coil to melt an edge portion of a sealing wafer pressed against the circumference of an opening in the body of the lamp envelope. The pressure vessel and the lamp envelope are filled with desired fill materials. Induction heating is carried out by the induction coil and induction receiver that presses against the wafer, the lamp envelope or both to hold the melting piece or pieces in contact. The induction receiver may be fused to the lamp body forming a functional part of the overall lamp structure. The preferred resulting lamp includes a bonded metal piece that can be conveniently used for electrical or mechanical coupling or positioning of the lamp with respect to a base.