发明授权
US06641962B2 Micro devices manufacturing method utilizing concave and convex alignment mark patterns 失效
微型器件制造方法利用凹凸对准标记图案

  • 专利标题: Micro devices manufacturing method utilizing concave and convex alignment mark patterns
  • 专利标题(中): 微型器件制造方法利用凹凸对准标记图案
  • 申请号: US10375012
    申请日: 2003-02-28
  • 公开(公告)号: US06641962B2
    公开(公告)日: 2003-11-04
  • 发明人: Shinji MizutaniKazuya OtaMasahiko Yasuda
  • 申请人: Shinji MizutaniKazuya OtaMasahiko Yasuda
  • 优先权: JP6/134006 19940616; JP6/183002 19940713
  • 主分类号: G03F900
  • IPC分类号: G03F900
Micro devices manufacturing method utilizing concave and convex alignment mark patterns
摘要:
An exposure method according to the present invention includes a first step of forming on a substrate an alignment mark including a concave and convex pattern; a second step of forming a coat over said alignment mark and the other area on said substrate; a third step of flattening said coat; and a fourth step of applying a photosensitive material on said coat flattened by said third step and projecting a mask pattern thereto. The alignment mark is formed by said concave and convex pattern arranged with a pitch which is smaller than the predetermined value between adjacent convex portions having a width of not less than a predetermined value.
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