Invention Grant
- Patent Title: Microelectromechanical switch
- Patent Title (中): 微机电开关
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Application No.: US09741128Application Date: 2000-12-19
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Publication No.: US06642593B2Publication Date: 2003-11-04
- Inventor: Tsen-Hwang Lin , Yu-Pei Chen , Darius L. Crenshaw
- Applicant: Tsen-Hwang Lin , Yu-Pei Chen , Darius L. Crenshaw
- Main IPC: H01L2982
- IPC: H01L2982

Abstract:
A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.
Public/Granted literature
- US20010048141A1 Microelectromechanical switch Public/Granted day:2001-12-06
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