公开(公告)号：US06743656B2

公开(公告)日：2004-06-01

申请号：US10200979

申请日：2002-07-23

Applicant: John W. Orcutt ,  Andrew Steven Dewa ,  Tsen-Hwang Lin

Inventor： John W. Orcutt ,  Andrew Steven Dewa ,  Tsen-Hwang Lin

IPC: H01L2100

CPC classification number: G01P1/023 ,  B81B7/007 ,  H01L23/10 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract translation: 在半导体晶片上制造的改进的晶片级封装的微机电器件和使用最先进的晶片制造和封装技术的制造方法。 该器件包含在通过将硅晶片与有源电路接合到具有围绕每个器件的空腔的蚀刻硅晶片并通过薄膜玻璃密封件或通过焊料密封接合两个晶片而产生的密封腔中。 蚀刻的晶片和薄膜密封允许导体保持最小长度并匹配以改善电路的电气控制。 此外，该装置具有在焊接密封装置中的接地环的能力。 这些器件可以用引线接合技术封装在塑料封装中，或者可以焊接到区域阵列焊料连接封装。

公开(公告)号：US06642593B2

公开(公告)日：2003-11-04

申请号：US09741128

申请日：2000-12-19

Applicant: Tsen-Hwang Lin ,  Yu-Pei Chen ,  Darius L. Crenshaw

Inventor： Tsen-Hwang Lin ,  Yu-Pei Chen ,  Darius L. Crenshaw

IPC: H01L2982

CPC classification number: B81C1/00182 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/04 ,  H01G5/16 ,  H01G5/40 ,  H01H59/0009 ,  H01P1/127

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract translation: 微机电开关包括衬底，从衬底向外设置的绝缘体层以及从绝缘体层向外设置的电极。 开关还包括从绝缘体层和电极向外设置的电介质层，电介质层的介电常数大于或等于二十。 所述开关还包括从所述电介质层向外设置的膜层，所述膜层覆盖在支撑层上，所述支撑层可操作以将所述膜层从所述电介质层向外空间。

公开(公告)号：US06452238B1

公开(公告)日：2002-09-17

申请号：US09671487

申请日：2000-09-27

Applicant: John W. Orcutt ,  Andrew Steven Dewa ,  Tsen-Hwang Lin

Inventor： John W. Orcutt ,  Andrew Steven Dewa ,  Tsen-Hwang Lin

IPC: H01L2982

CPC classification number: G01P1/023 ,  B81B7/007 ,  H01L23/10 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: An improved wafer level encapsulated micro-electromechanical device fabricated on a semiconductor wafer and a method of manufacture using state-of-the-art wafer fabrication and packaging technology. The device is contained within a hermetic cavity produced by bonding a silicon wafer with active circuits to an etched silicon wafer having cavities which surround each device, and bonding the two wafer by either thin film glass seal or by solder seal. The etched wafer and thin film sealing allow conductors to be kept to a minimum length and matched for improved electrical control of the circuit. Further, the device has capability for a ground ring in the solder sealed device. The devices may be packaged in plastic packages with wire bond technology or may be solder connected to an area array solder connected package.

Abstract translation: 在半导体晶片上制造的改进的晶片级封装的微机电器件和使用最先进的晶片制造和封装技术的制造方法。 该器件包含在通过将硅晶片与有源电路接合到具有围绕每个器件的空腔的蚀刻硅晶片并通过薄膜玻璃密封件或通过焊料密封接合两个晶片而产生的密封腔中。 蚀刻的晶片和薄膜密封允许导体保持最小长度并匹配以改善电路的电气控制。 此外，该装置具有在焊接密封装置中的接地环的能力。 这些器件可以用引线接合技术封装在塑料封装中，或者可以焊接到区域阵列焊料连接封装。

公开(公告)号：US06356418B1

公开(公告)日：2002-03-12

申请号：US09343420

申请日：1999-06-30

Applicant: Mark W. Heaton ,  Michael K. Masten ,  Mark A. Avery ,  Philip A. Congdon ,  Tsen-Hwang Lin

Inventor： Mark W. Heaton ,  Michael K. Masten ,  Mark A. Avery ,  Philip A. Congdon ,  Tsen-Hwang Lin

IPC: G11B556

CPC classification number: G11B5/5552

Abstract: An integral computer hard drive microactuator support comprising a unitary member of solid material. The support includes a frame portion surrounding and defining an opening portion, and a platform portion disposed within the opening portion. Four fixed-fixed beam portions connect the platform portion to the frame portion, the fixed-fixed beam portions being generally rectangular in cross section and substantially straight along their length.

Abstract translation: 一体的计算机硬盘微型致动器支架，包括固体材料的整体构件。 支撑件包括围绕并限定开口部分的框架部分和设置在开口部分内的平台部分。 四个固定固定梁部分将平台部分连接到框架部分，固定固定梁部分的横截面通常为矩形并且沿其长度基本上是直的。

公开(公告)号：US5982569A

公开(公告)日：1999-11-09

申请号：US912038

申请日：1997-08-15

Applicant: Tsen-Hwang Lin ,  Phillip A. Congdon

Inventor： Tsen-Hwang Lin ,  Phillip A. Congdon

IPC: G11B5/09 ,  G11B5/012 ,  G11B5/02 ,  G11B5/48 ,  G11B20/10 ,  G11B25/04

CPC classification number: G11B20/10009 ,  G11B5/488 ,  G11B5/012

Abstract: A read/write data interface (26) is provided that interfaces with a read/write head (28) and is positioned in close proximity to the read/write head (28). The read/write data interface (26) includes a pre-amplifier (46) and a read channel (44). The pre-amplifier (46) amplifies an analog read signal and generates an amplified analog read signal in response. The read channel (44) receives the amplified analog read signal and generates a digital read signal in response.

Abstract translation: 提供了读/写数据接口（26），其与读/写头（28）接口并且被定位成紧靠读/写头（28）。 读/写数据接口（26）包括前置放大器（46）和读通道（44）。 前置放大器（46）放大模拟读取信号并响应产生放大的模拟读取信号。 读取通道（44）接收放大的模拟读取信号并产生响应的数字读取信号。

公开(公告)号：US5590367A

公开(公告)日：1996-12-31

申请号：US466028

申请日：1995-06-06

Applicant: Tsen-Hwang Lin ,  Falvey Malarcher

Inventor： Tsen-Hwang Lin ,  Falvey Malarcher

IPC: G02F3/00 ,  G02B6/35 ,  G06E3/00 ,  G06F13/38 ,  G06F15/80 ,  G06F3/00

CPC classification number: G02B6/3556 ,  G06E3/001 ,  G02B6/3512 ,  G02B6/357

Abstract: This is a processing module which may be used for parallel processing. Multiple software configurable optical interconnections provide for high speed processing which preferably use computer generated holograms to communicate among multiple processing elements. Other methods and devices are disclosed.

Abstract translation: 这是可以用于并行处理的处理模块。 多个软件可配置的光互连提供了高速处理，其优选地使用计算机产生的全息图在多个处理元件之间进行通信。 公开了其它方法和装置。

公开(公告)号：US5508841A

公开(公告)日：1996-04-16

申请号：US369979

申请日：1995-01-09

Applicant: Tsen-Hwang Lin ,  James M. Florence ,  Michael Leddy ,  Mark Boysel

Inventor： Tsen-Hwang Lin ,  James M. Florence ,  Michael Leddy ,  Mark Boysel

IPC: G02B26/06 ,  G02B26/08 ,  G02B27/52 ,  G02F1/31

CPC classification number: G02B27/52 ,  G02B26/06 ,  G02B26/0841

Abstract: A phase-contrast DMD based image system 36 for projecting an amplitude and phase modulated image. A flexure beam DMD array 34 is used to allow analog phase modulation of reflected light 38. The phase modulation is converted to amplitude modulation by the phase-contrast imaging optics including a phase plate 42. The resulting amplitude modulated wave is flicker-free and does not need to be synchronized to optical image sensors.

Abstract translation: 一种用于投影幅度和相位调制图像的基于相位差的基于DMD的图像系统36。 弯曲光束DMD阵列34用于允许反射光38的模拟相位调制。相位调制通过包括相位板42的相位差成像光学器件转换为幅度调制。所得到的幅度调制波是无闪烁的，并且 不需要与光学图像传感器同步。

公开(公告)号：US06764872B2

公开(公告)日：2004-07-20

申请号：US10255839

申请日：2002-09-27

Applicant: Tsen-Hwang Lin ,  Yu-Pei Chen ,  Darius L. Crenshaw

Inventor： Tsen-Hwang Lin ,  Yu-Pei Chen ,  Darius L. Crenshaw

IPC: H01L2100

CPC classification number: B81C1/00182 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/0127 ,  B81B2203/04 ,  H01G5/16 ,  H01G5/40 ,  H01H59/0009 ,  H01P1/127

Abstract: A microelectromechanical switch includes a substrate, an insulator layer disposed outwardly from the substrate, and an electrode disposed outwardly from the insulator layer. The switch also includes a dielectric layer disposed outwardly from the insulator layer and the electrode, the dielectric layer having a dielectric constant of greater than or equal to twenty. The switch also includes a membrane layer disposed outwardly from the dielectric layer, the membrane layer overlying a support layer, the support layer operable to space the membrane layer outwardly from the dielectric layer.

Abstract translation: 微机电开关包括衬底，从衬底向外设置的绝缘体层以及从绝缘体层向外设置的电极。 开关还包括从绝缘体层和电极向外设置的电介质层，电介质层的介电常数大于或等于二十。 所述开关还包括从所述电介质层向外设置的膜层，所述膜层覆盖在支撑层上，所述支撑层可操作以将所述膜层从所述电介质层向外空间。

公开(公告)号：US06295154B1

公开(公告)日：2001-09-25

申请号：US09310284

申请日：1999-05-12

Applicant: Herzel Laor ,  Philip A. Congdon ,  Andrew S. Dewa ,  David I. Forehand ,  Tsen-Hwang Lin ,  John W. Orcutt ,  James A. Sisco

Inventor： Herzel Laor ,  Philip A. Congdon ,  Andrew S. Dewa ,  David I. Forehand ,  Tsen-Hwang Lin ,  John W. Orcutt ,  James A. Sisco

IPC: G02B2608

CPC classification number: G02B6/3512 ,  G02B6/3518 ,  G02B6/3548 ,  G02B6/3558 ,  G02B6/3572 ,  G02B6/358 ,  G02B6/3582 ,  G02B6/359 ,  G02B26/085 ,  G02B26/101 ,  Y10S359/904

Abstract: An optical matrix switch station (1) is shown mounting a plurality of optical switch units (15, 17), each of which includes a mirror (29), moveable in two axes, for purpose of switching optical beams from one optical fiber to another. A mirror assembly (41) includes a single body of silicon comprising a frame portion (43), gimbals (45), mirror portion (47), and related hinges (55). Magnets (53, 54) and air coils (89) are utilized to position the central mirror surface (29) to a selected orientation. The moveable mirror and associated magnets along with control LED's (71) are hermetically packaged in a header (81) and mounted with the air coils on mounting bracket (85) to form a micromirror assembly package (99) mounted in each optical switch unit.

Abstract translation: 光学矩阵切换台（1）被示出为安装多个光开关单元（15,17），每个光开关单元包括可在两个轴上移动的反射镜（29），用于将光束从一根光纤切换到另一根光纤 。 反射镜组件（41）包括单体硅，其包括框架部分（43），万向节（45），反射镜部分（47）和相关铰链（55）。 使用磁体（53,54）和空气线圈（89）将中央镜面（29）定位到所选取向。 可移动镜和相关磁体以及控制LED（71）被气密地封装在集管（81）中，并且将空气线圈安装在安装支架（85）上，以形成安装在每个光开关单元中的微镜组件封装（99）。

公开(公告)号：US5548772A

公开(公告)日：1996-08-20

申请号：US323427

申请日：1994-10-14

Applicant: Tsen-Hwang Lin ,  Falvey Malarcher

Inventor： Tsen-Hwang Lin ,  Falvey Malarcher

IPC: G02F3/00 ,  G02B6/35 ,  G06E3/00 ,  H04B10/00 ,  H04B10/22 ,  G03H1/00 ,  G02F1/00 ,  G03H1/12 ,  G06F15/00

CPC classification number: G02B6/3556 ,  G06E3/001 ,  G02B6/3512 ,  G02B6/3582

Abstract: This is a programmable processing system which comprises: one or more computer networks each of the networks has at least one population of processor nodes; at least one population of storage nodes; and at least one switch to provide transfer of information between the processor nodes and the storage nodes. Each processor node has at least one processing module comprising spatial light modulators; processors; and at least one hologram. Other methods and devices are disclosed.

Abstract translation: 这是可编程处理系统，其包括：一个或多个计算机网络，每个网络具有至少一个处理器节点群; 至少一个存储节点群; 以及至少一个交换机，用于在处理器节点和存储节点之间提供信息传送。 每个处理器节点具有至少一个包括空间光调制器的处理模块; 处理器 和至少一个全息图。 公开了其它方法和装置。