发明授权
US06646063B2 Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
有权
半导体装置及其制造方法，以及包含环氧树脂组合物的片剂
- 专利标题： Semiconductor device and process for producing the same, and tablet comprising epoxy resin composition
- 专利标题（中）： 半导体装置及其制造方法，以及包含环氧树脂组合物的片剂
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申请号： US09819710申请日： 2001-03-29
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公开(公告)号： US06646063B2公开(公告)日： 2003-11-11
- 发明人: Akihisa Kuroyanagi , Hisataka Ito , Shinichirou Sudo , Hirofumi Oono
- 申请人： Akihisa Kuroyanagi , Hisataka Ito , Shinichirou Sudo , Hirofumi Oono
- 优先权： JP2000-092028 20000329; JP2000-092029 20000329; JP2000-092030 20000329
- 主分类号： C08L6108
- IPC分类号： C08L6108
摘要：
A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.
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