公开(公告)号：US06852263B2

公开(公告)日：2005-02-08

申请号：US10662451

申请日：2003-09-16

申请人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

发明人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

IPC分类号： H01L23/10 ,  C08L61/08 ,  H01L21/56 ,  H01L23/498

CPC分类号： H01L21/565 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

摘要翻译： 一种用于制造基本上没有弯曲的半导体器件的片剂，其包含环氧树脂和环氧树脂组合物，其中所述片剂具有通过加热减少的量小于0.05重量％的特征; 具有树脂层的晶片和使用该片剂制造的半导体器件; 以及用于制造晶片和半导体器件的工艺。

公开(公告)号：US06933618B2

公开(公告)日：2005-08-23

申请号：US10843339

申请日：2004-05-12

申请人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

发明人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

IPC分类号： H01L23/10 ,  C08L61/08 ,  H01L21/56 ,  H01L23/498 ,  H01L23/28

CPC分类号： H01L21/565 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

摘要翻译： 一种用于制造基本上没有弯曲的半导体器件的片剂，其包含环氧树脂和环氧树脂组合物，其中所述片剂具有通过加热减少的量小于0.05重量％的特征; 具有树脂层的晶片和使用该片剂制造的半导体器件; 以及用于制造晶片和半导体器件的工艺。

公开(公告)号：US06646063B2

公开(公告)日：2003-11-11

申请号：US09819710

申请日：2001-03-29

申请人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

发明人： Akihisa Kuroyanagi ,  Hisataka Ito ,  Shinichirou Sudo ,  Hirofumi Oono

IPC分类号： C08L6108

CPC分类号： H01L21/565 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating being less than 0.05% by weight; a wafer with a resin layer and a semiconductor device produced by using the tablet; and a process for producing the wafer and the semiconductor device.

摘要翻译： 一种用于制造基本上没有弯曲的半导体器件的片剂，其包含环氧树脂和环氧树脂组合物，其中所述片剂具有通过加热减少的量小于0.05重量％的特征; 具有树脂层的晶片和使用该片剂制造的半导体器件; 以及用于制造晶片和半导体器件的工艺。

公开(公告)号：US20050023715A1

公开(公告)日：2005-02-03

申请号：US10892186

申请日：2004-07-16

申请人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

发明人： Hirofumi Oono ,  Minoru Yamane ,  Yasunobu Ina ,  Shouichi Umeno

IPC分类号： H01L21/56 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29C45/46 ,  H01L23/28 ,  H01L23/29

CPC分类号： B29C45/462 ,  B29B9/04 ,  B29B9/08 ,  B29B9/10 ,  B29B9/12 ,  B29K2063/00 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing a semiconductor-molding tablet, which can reduce formation of voids in the package due to increased density of the tablet. The method comprises a step of kneading an epoxy resin composition comprising components (A) an epoxy resin, (B) a phenol resin, and (C) an inorganic filler as essential components, a step of roll-molding the resulting kneaded composition into a sheet shape having a sheet density ratio of 98% or more, a step of pulverizing the resulting sheet-shaped compact, and a step of forming the pulverized material into a tablet shape having a tablet density ratio of 94% or more and less than 98%.

摘要翻译： 一种用于制造半导体成型片剂的方法，其可以由于片剂的密度增加而减少包装中空隙的形成。 该方法包括将包含（A）环氧树脂，（B）酚醛树脂和（C）无机填料）作为必要组分的环氧树脂组合物捏合的步骤，将所得捏合组合物辊压成型为 具有98％以上的片材密度比的片状，对所得片状成形体进行粉碎的工序，以及将粉碎物形成为片状密度为94％以上且小于98的片状的工序 ％。