- 专利标题: Chip component take-in apparatus
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申请号: US09924844申请日: 2001-08-09
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公开(公告)号: US06655547B2公开(公告)日: 2003-12-02
- 发明人: Koji Saito , Taro Yasuda , Hiroyuki Matsui
- 申请人: Koji Saito , Taro Yasuda , Hiroyuki Matsui
- 优先权: JPH8-337247 19961217
- 主分类号: B65G4724
- IPC分类号: B65G4724
摘要:
A chip component take-in apparatus takes in and guides downward prismatic chip components stored in a bulk state in a storage chamber one by one in a predetermined direction. When a first take-in member and a second take-in member are relatively moved up and down in each flat face contact state, the chip components in face contact with the flat faces of the take-in members are gradually guided to a center along guide ways. The guided chip components in the longitudinal direction thereof are taken into a passage constituted by grooves and are moved downward along the passage by self-weight.
公开/授权文献
- US20010052446A1 Chip component take-in apparatus 公开/授权日:2001-12-20
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