发明授权
US06667511B1 NAND type core cell structure for a high density flash memory device having a unique select gate transistor configuration 失效
具有独特的选择栅极晶体管配置的高密度闪存器件的NAND型核心单元结构

  • 专利标题: NAND type core cell structure for a high density flash memory device having a unique select gate transistor configuration
  • 专利标题(中): 具有独特的选择栅极晶体管配置的高密度闪存器件的NAND型核心单元结构
  • 申请号: US08993368
    申请日: 1997-12-18
  • 公开(公告)号: US06667511B1
    公开(公告)日: 2003-12-23
  • 发明人: Hao Fang
  • 申请人: Hao Fang
  • 主分类号: H01L29788
  • IPC分类号: H01L29788
NAND type core cell structure for a high density flash memory device having a unique select gate transistor configuration
摘要:
A method of forming a NAND-type flash memory device including forming a stacked gate flash memory structure (346) containing an interpoly dielectric layer (322) for one or more flash memory cells in a core region (305). The method also includes forming a select gate transistor structure (348) having a first gate oxide (322) formed of the interpoly dielectric material and a gate conductor (338) overlying the first gate oxide (322) in the core region (305). A NAND-type flash memory device includes a core region (305) comprising a stacked gate flash memory cell structure (346) and a select gate transistor (348) and a periphery region (314, 315) comprising a low voltage transistor (342) and a high voltage transistor (350). The stacked gate flash memory cell structure (346) includes a tunnel oxide layer (308), a poly1 layer (312) overlying the tunnel oxide layer (308), an interpoly dielectric layer (322) formed of an insulating material overlying the poly1 layer (312) and a poly2 layer (338) overlying the interpoly dielectric layer (322). In addition, the select gate transistor structure (348) includes a gate insulator (322) formed of the insulating material and a poly2 layer (338) overlying the gate insulator (322).
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