发明授权
- 专利标题: Plasma treatment apparatus and plasma treatment method
- 专利标题(中): 等离子体处理装置和等离子体处理方法
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申请号: US09863474申请日: 2001-05-24
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公开(公告)号: US06670766B2公开(公告)日: 2003-12-30
- 发明人: Keiichi Yamazaki , Yukiko Inooka , Yasushi Sawada , Noriyuki Taguchi , Yoshiyuki Nakazono , Akio Nakano
- 申请人: Keiichi Yamazaki , Yukiko Inooka , Yasushi Sawada , Noriyuki Taguchi , Yoshiyuki Nakazono , Akio Nakano
- 优先权: JP2000-169571 20000606
- 主分类号: H01J724
- IPC分类号: H01J724
摘要:
A plasma treatment apparatus and a plasma treatment method having the capability of uniformly treating an object with plasma at a high treatment speed. This apparatus includes a tubular vessel having a laterally elongated cross section, a pair of electrodes arranged such that electric flux lines develop substantially in an axial direction of the tubular vessel when one of an AC voltage and a pulse voltage is applied between the electrodes, a gas supply for supplying a streamer generation gas into the tubular vessel, a power source for applying the voltage between the electrodes to generate plural streamers of the gas in the tubular vessel, and a plasma uniformity mechanism for making the plural streamers uniform in a lateral direction of the laterally elongated cross section of the tubular vessel to provide the plasma from one end of the tubular vessel.
公开/授权文献
- US20020008480A1 Plasma treatment apparatus and plasma treatment method 公开/授权日:2002-01-24
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