发明授权
US06670921B2 Low-cost HDMI-D packaging technique for integrating an efficient reconfigurable antenna array with RF MEMS switches and a high impedance surface
有权
低成本HDMI-D封装技术，用于将高效可重构天线阵列与RF MEMS开关和高阻抗表面集成
- 专利标题： Low-cost HDMI-D packaging technique for integrating an efficient reconfigurable antenna array with RF MEMS switches and a high impedance surface
- 专利标题（中）： 低成本HDMI-D封装技术，用于将高效可重构天线阵列与RF MEMS开关和高阻抗表面集成
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申请号： US09906035申请日： 2001-07-13
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公开(公告)号： US06670921B2公开(公告)日： 2003-12-30
- 发明人: Daniel F. Sievenpiper , Adele E. Schmitz , James H. Schaffner , Gregory L. Tangonan , Tsung-Yuan Hsu , Robert Y. Loo , Robert S. Miles
- 申请人： Daniel F. Sievenpiper , Adele E. Schmitz , James H. Schaffner , Gregory L. Tangonan , Tsung-Yuan Hsu , Robert Y. Loo , Robert S. Miles
- 主分类号： H01Q138
- IPC分类号： H01Q138
摘要：
A flexible antenna array comprises a plurality of layers of thin metal and a flexible insulating medium arranged as a sandwich of layers. Each layer of the sandwich is patterned as needed to define: (i) antenna segments patterned in one of the metal layers, (ii) an array of metallic top elements formed in a layer spaced from the the antenna segments, the array of metallic top elements being patterned in another metal layer, (iii) a metallic ground plane formed in a layer spaced from the array of metallic top elements, the metallic ground plane having been formed from still another metal layer, and (iv) inductive elements coupling each of the top elements in the array of metallic top elements with said ground plan. An array of remotely controlled switches are provided for coupling selected ones of said antenna segments together.
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