Invention Grant
US06673190B2 Lasable bond-ply materials for high density printed wiring boards
失效
用于高密度印刷线路板的可激光键合层材料
- Patent Title: Lasable bond-ply materials for high density printed wiring boards
- Patent Title (中): 用于高密度印刷线路板的可激光键合层材料
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Application No.: US09826718Application Date: 2001-04-04
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Publication No.: US06673190B2Publication Date: 2004-01-06
- Inventor: David Haas , Chengzeng Xu , Mavyn McAuliffe , Scott Zimmerman , Laura Miller , Meifang Qin , Baopei Xu , Richard Pommer
- Applicant: David Haas , Chengzeng Xu , Mavyn McAuliffe , Scott Zimmerman , Laura Miller , Meifang Qin , Baopei Xu , Richard Pommer
- Main IPC: B32B3100
- IPC: B32B3100
Abstract:
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
Public/Granted literature
- US20020004352A1 Lasable bond-ply materials for high density printed wiring boards Public/Granted day:2002-01-10
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