摘要:
An extendable comfort razor comprising: an elongated body, where the elongated body extends the length of the extendable comfort razor; a handle at a top end of the elongated body, where the handle curves from the elongated body; a razor portion attached to a bottom end of the elongated body, where the razor portion slides in and out of the elongated body and where the razor portion receives a replacement cartridge; a set of adjustment notches along a middle portion of the elongated body; and a set of buttons along the razor portion wherein at least one of the buttons engage at least one of the adjustment notches to lock the elongated body at a desired length thereby allowing the replacement cartridge to reach a desired portion on a body of a user.
摘要:
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
摘要:
A method and system for supporting simultaneous operation of operating systems on a single integrated circuit. The system includes a supervisory operating system (SOS) managing execution of instructions, each instruction being executable under one of the operating systems; registers grouped into multiple sets of registers, each set maintaining an identity of one of the operating systems; and a dispatcher capable of dispatching an instruction and a tag attached to the instruction, the tag identifying one of the operating systems and the instruction to be executed under the identified operating system to access one of the registers. One or more of the registers are utilized when the instruction is executed, and are included in a single set of the multiple sets of registers. The single set maintains the identity of the operating system identified by the tag, and each of the one or more registers includes an identifier matching the tag.
摘要:
This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.