发明授权
- 专利标题： Multi-layer interconnection board
- 专利标题（中）： 多层互连板
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申请号： US10096647申请日： 2002-03-14
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公开(公告)号： US06674015B2公开(公告)日： 2004-01-06
- 发明人: Shinji Aoki
- 申请人： Shinji Aoki
- 优先权： JP2001-283801 20010918
- 主分类号： H05K103
- IPC分类号： H05K103
摘要：
A multi-layer interconnection board, includes a multi-layer structure in which plural interconnections are provided and which includes a ground layer, and a hole part provided in the multi-layer structure. A conductive part is provided on an internal wall part of the hole part.
公开/授权文献
- US20030051902A1 Multi-layer interconnection board 公开/授权日：2003-03-20
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