发明授权
US06677107B1 Method for manufacturing semiconductor integrated circuit device, optical mask used therefor, method for manufacturing the same, and mask blanks used therefor
有权
用于制造半导体集成电路器件的方法，用于其的光学掩模，其制造方法和用于其的掩模毛坯
- 专利标题： Method for manufacturing semiconductor integrated circuit device, optical mask used therefor, method for manufacturing the same, and mask blanks used therefor
- 专利标题（中）： 用于制造半导体集成电路器件的方法，用于其的光学掩模，其制造方法和用于其的掩模毛坯
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申请号： US09646036申请日： 2000-09-13
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公开(公告)号： US06677107B1公开(公告)日： 2004-01-13
- 发明人: Norio Hasegawa , Tsuneo Terasawa , Toshihiko Tanaka
- 申请人： Norio Hasegawa , Tsuneo Terasawa , Toshihiko Tanaka
- 优先权： JP11/185221 19990630
- 主分类号： G03C500
- IPC分类号： G03C500
摘要：
In order to suppress or prevent the occurrence of foreign matter in the manufacture of a semiconductor integrated circuit device by the use of a photo mask constituted in such a manner that a resist film is made to function as a light screening film, inspection or exposure treatment is carried out, when the photo mask 1PA1 has been mounted on a predetermined apparatus such as, e.g., an inspection equipment or aligner, in the state in which a mounting portion 2 of the predetermined apparatus is contacted with that region of a major surface of a mask substrate 1a of the photo mask 1PA1 in which a light shielding pattern 1b and a mask pattern 1mr, each formed of a resist film, on the major surface of the mask substrate 1a do not exist.
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