发明授权
US06677167B2 Wafer processing apparatus and a wafer stage and a wafer processing method
失效
晶片处理装置和晶片台以及晶片处理方法
- 专利标题： Wafer processing apparatus and a wafer stage and a wafer processing method
- 专利标题（中）： 晶片处理装置和晶片台以及晶片处理方法
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申请号： US10086722申请日： 2002-03-04
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公开(公告)号： US06677167B2公开(公告)日： 2004-01-13
- 发明人: Seiichiro Kanno , Hironobu Kawahara , Mitsuru Suehiro , Saburou Kanai , Toshio Masuda
- 申请人： Seiichiro Kanno , Hironobu Kawahara , Mitsuru Suehiro , Saburou Kanai , Toshio Masuda
- 主分类号： H01L2166
- IPC分类号： H01L2166
摘要：
A wafer processing apparatus comprising a wafer stage, wherein a semiconductor wafer is mounted on the wafer stage so as to process the semiconductor wafer, wherein a holding mechanism of the wafer stage is commonly used for a plurality of wafer stages, and accordingly, the wafer stage can be changed into a wafer stage having a different function so as to process the semiconductor wafer.
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