发明授权
US06679946B1 Method and apparatus for controlling substrate temperature and layer thickness during film formation 有权
在成膜期间控制基板温度和层厚度的方法和装置

  • 专利标题: Method and apparatus for controlling substrate temperature and layer thickness during film formation
  • 专利标题(中): 在成膜期间控制基板温度和层厚度的方法和装置
  • 申请号: US09967212
    申请日: 2001-09-27
  • 公开(公告)号: US06679946B1
    公开(公告)日: 2004-01-20
  • 发明人: Andrew William JacksonMark J. Dalberth
  • 申请人: Andrew William JacksonMark J. Dalberth
  • 主分类号: C30B2508
  • IPC分类号: C30B2508
Method and apparatus for controlling substrate temperature and layer thickness during film formation
摘要:
A method and apparatus for determining substrate temperature and the mirror center of a film structure formed on the substrate utilizes a transmission intensity spectrum of light to determine mirror center and a normalized transmission intensity spectrum of light to determine substrate temperature. White light is transmitted through the substrate and the film structure during the film structure formation process. Also during the film formation process, a reflected light intensity spectrum is obtained using the same or another light source, for light reflected by the film structure. Substrate temperature and mirror center may be determined during formation of the film structure and, based on the measured temperature and mirror center, the mirror center may be adjusted by changing film formation conditions during the film formation process to vary the thickness of the films being formed. The method and apparatus find particular application in the in-situ monitoring and adjustment of distributed Bragg reflectors used as semiconductor mirrors.
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