发明授权
- 专利标题： Conductive powder and making process
- 专利标题（中）： 导电粉和制作工艺
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申请号： US10102846申请日： 2002-03-22
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公开(公告)号： US06680081B2公开(公告)日： 2004-01-20
- 发明人: Motoo Fukushima , Kunio Itoh , Shigeru Mori , Masaki Kasashima , Yoshitaka Hamada , Mikio Aramata
- 申请人： Motoo Fukushima , Kunio Itoh , Shigeru Mori , Masaki Kasashima , Yoshitaka Hamada , Mikio Aramata
- 优先权： JP11-132501 19990513; JP11-193354 19990707; JP11-337727 19991129
- 主分类号： C23C1832
- IPC分类号： C23C1832
摘要：
A conductive powder having an organic silicon polymer layer on the surface of each particle and a metal layer enclosing the silicon polymer layer possesses a stronger bond between the particle base and the metal even at elevated temperature and exhibits a high and stable conductivity and heat resistance.
公开/授权文献
- US20020142094A1 Conductive powder and making process 公开/授权日：2002-10-03
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