发明授权
US06680241B2 Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
失效
通过将晶片分成芯片和这种半导体器件来制造半导体器件的方法
- 专利标题： Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
- 专利标题（中）： 通过将晶片分成芯片和这种半导体器件来制造半导体器件的方法
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申请号： US09735476申请日： 2000-12-14
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公开(公告)号： US06680241B2公开(公告)日： 2004-01-20
- 发明人: Tadahiro Okamoto , Hirohisa Matsuki
- 申请人： Tadahiro Okamoto , Hirohisa Matsuki
- 优先权： JP2000-224245 20000725
- 主分类号： H01L21301
- IPC分类号： H01L21301
摘要：
A plurality of chips divided from a semiconductor wafer having a plurality of semiconductor integrated circuits formed on a front surface of the wafer, are prepared, front surfaces of the chips being bonded to a first wafer sheet. The back and side surfaces of each chip bonded to the first wafer sheet are covered with a reinforcing thin film. Each of the plurality of chips is removed from the first wafer sheet. The flexural strength of a chip can be suppressed from being lowered by chipping and chip cracks.
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