Plating catalysts and electronic packaging substrates plated therewith

Invention Grant

US06680273B2 Plating catalysts and electronic packaging substrates plated therewith 有权

Title translation: 电镀催化剂和电子封装基板

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Patent Title: Plating catalysts and electronic packaging substrates plated therewith
Patent Title (中): 电镀催化剂和电子封装基板
Application No.: US10000865

Application Date: 2001-10-24
Publication No.: US06680273B2

Publication Date: 2004-01-20
Inventor: Martin T. Goosey , Narinder Singh Bains
Applicant: Martin T. Goosey , Narinder Singh Bains
Priority: GB0025990 20001024
Main IPC: B01J3100
IPC: B01J3100

Plating catalysts and electronic packaging substrates plated therewith

Abstract:

Disclosed are new catalysts for electroless metallization deposition, particularly catalysts that can be selectively activated and may be free of palladium and/or tin. Catalysts of the invention are preferably employed for electroless copper deposition.

Abstract(Chinese):

公开了用于无电金属化沉积的新催化剂，特别是可以选择性活化并且可以不含钯和/或锡的催化剂。本发明的催化剂优选用于无电沉积铜。

Public/Granted literature

US20020069788A1 Plating catalysts and electronic packaging substrates plated therewith Public/Granted day:2002-06-13

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