发明授权
- 专利标题: Thermal expansion compensated opto-electronic semiconductor element, particularly ultraviolet (UV) light emitting diode, and method of its manufacture
- 专利标题(中): 热膨胀补偿光电子半导体元件,特别是紫外(UV)发光二极管及其制造方法
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申请号: US10218887申请日: 2002-08-14
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公开(公告)号: US06683325B2公开(公告)日: 2004-01-27
- 发明人: Guenter Waitl , Alfred Langer , Reinhard Weitzel
- 申请人: Guenter Waitl , Alfred Langer , Reinhard Weitzel
- 主分类号: H01L29267
- IPC分类号: H01L29267
摘要:
An opto-electronic semiconductor element has a radiation emitting or receiving, that is, radiation active semiconductor chip secured to an electrically conductive base frame. One, or a plurality of chips, are surrounded by a housing which may be integral with or have, separately, a cover. All materials of the housing, as well as of the conductive base frame, have mutually matching thermal coefficients of expansion within the temperature ranges which arise during manufacture and in application of the semiconductive element, singly or as a plurality in a common housing. Glass, quartz glass, ceramic or glass ceramic are suitable for the housing or parts thereof; the conductive base frame is preferably made of cladded or jacketed copper wire or strip with an iron-nickel core. Assembling a plurality of chips in a housing which has a luminescence conversion layer, e.g. a phosphor applied thereto, permits construction of a flat light source.
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