发明授权
US06683683B2 Defect inspection method and apparatus for silicon wafer 失效
硅片缺陷检查方法及装置

Defect inspection method and apparatus for silicon wafer
摘要:
A defect inspection apparatus for detecting defects existing on a surface of a semiconductor sample and/or inside the sample based on light information from the sample obtained by irradiating a light beam onto the sample is provided, which comprises a detecting means for detecting positions in the depth direction where the defects exist and distribution of the defects based on the light information; a setting means for setting a position in the depth direction where defects exist; and a means for displaying the distribution of the defects obtained by the detecting means, the displaying means displaying the distribution of the defects corresponding to the position in the depth direction set by the setting means.
公开/授权文献
信息查询
0/0