发明授权
US06693298B2 Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
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用于制造绝缘体外延半导体(SOI)结构的结构和方法以及利用形成用于形成绝缘体材料的材料形成柔性衬底的器件
- 专利标题: Structure and method for fabricating epitaxial semiconductor on insulator (SOI) structures and devices utilizing the formation of a compliant substrate for materials used to form same
- 专利标题(中): 用于制造绝缘体外延半导体(SOI)结构的结构和方法以及利用形成用于形成绝缘体材料的材料形成柔性衬底的器件
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申请号: US09908707申请日: 2001-07-20
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公开(公告)号: US06693298B2公开(公告)日: 2004-02-17
- 发明人: Kurt W. Eisenbeiser , Zhiyi Yu , Ravindranath Droopad
- 申请人: Kurt W. Eisenbeiser , Zhiyi Yu , Ravindranath Droopad
- 主分类号: H01L2904
- IPC分类号: H01L2904
摘要:
High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. A monocrystalline layer is then formed over the accommodating buffer layer, such that a lattice constant of the monocrystalline layer substantially matches the lattice constant of a subsequently grown monocrystalline film.
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