Invention Grant
US06694583B2 Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate 有权
嵌入式多层电容器在低温共烧陶瓷(LTCC)衬底中

  • Patent Title: Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate
  • Patent Title (中): 嵌入式多层电容器在低温共烧陶瓷(LTCC)衬底中
  • Application No.: US09785109
    Application Date: 2001-02-16
  • Publication No.: US06694583B2
    Publication Date: 2004-02-24
  • Inventor: Shaul Branchevsky
  • Applicant: Shaul Branchevsky
  • Main IPC: H01G700
  • IPC: H01G700
Embedded multi-layer capacitor in a low-temperature co-fired ceramic (LTCC) substrate
Abstract:
An apparatus and method for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual electrode layers must be connected electrically. According to the present invention, a multi-layer capacitor is formed on a first ceramic tape layer. A second tape layer having an opening is placed on top of the first layer. The opening in the second layer is formed such that exposed vias are present on at least two sides of the opening to electrically connect to the electrodes. When the tape layers are pressed and fired, the exposed vias and electrodes form common electrical connections. A third layer having a terminal via may be placed on top of the second layer.
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