公开(公告)号：US20090159915A1

公开(公告)日：2009-06-25

申请号：US12249149

申请日：2008-10-10

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01L33/00

CPC classification number: H01L33/505 ,  H01L25/0753 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED insert module formed of a conducting carrier and a multi-layer lens is described. Layers of the lens are doped with phosphorescent material in order to control appearance of light produced by an LED die located in the insert module. Multiple modules may be embedded in a heat sink in order that the multiple modules may provide illumination to an area.

Abstract translation: 描述了由导电载体和多层透镜形成的LED插入模块。 透镜的层掺杂有磷光材料，以便控制由位于插入模块中的LED管芯产生的光的外观。 多个模块可以嵌入在散热器中，以便多个模块可以向一个区域提供照明。

公开(公告)号：US06694583B2

公开(公告)日：2004-02-24

申请号：US09785109

申请日：2001-02-16

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01G700

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/185 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/09645 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An apparatus and method for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual electrode layers must be connected electrically. According to the present invention, a multi-layer capacitor is formed on a first ceramic tape layer. A second tape layer having an opening is placed on top of the first layer. The opening in the second layer is formed such that exposed vias are present on at least two sides of the opening to electrically connect to the electrodes. When the tape layers are pressed and fired, the exposed vias and electrodes form common electrical connections. A third layer having a terminal via may be placed on top of the second layer.

Abstract translation: 一种用于在低温共烧陶瓷（LTCC）衬底中制造多层嵌入式陶瓷电容器的装置和方法。 为了形成多层电极，各个电极层必须电连接。 根据本发明，在第一陶瓷带层上形成多层电容器。 具有开口的第二带层被放置在第一层的顶部上。 第二层中的开口形成为使得暴露的通孔存在于开口的至少两侧以电连接到电极。 当带层被压制和烧制时，暴露的通孔和电极形成公共的电连接。 具有端子通孔的第三层可以放置在第二层的顶部上。

公开(公告)号：US06408511B1

公开(公告)日：2002-06-25

申请号：US09643387

申请日：2000-08-21

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01R900

CPC classification number: H01L21/486 ,  H01L21/4853 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/245 ,  H05K3/321 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/072 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for providing an enhanced ball grid array attachment in low-temperature co-fired ceramic (LTCC) substrate is provided. A termination cup is formed in a substrate. The termination cup has a bottom formed by a termination pad over a via in a first tape layer and side walls formed by termination sides formed over side walls of a via in a second tape layer. A diffusion layer is formed over the termination cup. The diffusion layer helps to reduce the oxidation of the termination cup and to provide greater mechanical attachment strength. An electrically conductive adhesive may be used to connect a solder ball to the diffusion layer. Reflow then is used to complete the solder ball connection process.

Abstract translation: 提供了一种用于在低温共烧陶瓷（LTCC）衬底中提供增强的球栅阵列附件的方法。 终端杯形成在基板中。 终端杯具有由第一带层中的通孔上的终端焊盘形成的底部，并且由在第二带层中的通孔的侧壁上形成的端接端形成的侧壁。 在终端杯上形成扩散层。 扩散层有助于减少端接杯的氧化并提供更大的机械附着强度。 可以使用导电粘合剂将焊球连接到扩散层。 回流则用于完成焊球连接过程。

公开(公告)号：US06252761B1

公开(公告)日：2001-06-26

申请号：US09396151

申请日：1999-09-15

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01G406

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/162 ,  H05K1/185 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/09645 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: An apparatus for creating multi-layer embedded ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates. In order to create multiple layers of electrodes, the individual electrode layers must be connected electrically. According to the present invention, a multi-layer capacitor is formed on a first ceramic tape layer. A second tape layer having an opening is placed on top of the first layer. The opening in the second layer is formed such that exposed vias are present on at least two sides of the opening to electrically connect to the electrodes. When the tape layers are pressed and fired, the exposed vias and electrodes form common electrical connections. A third layer having a terminal via may be placed on top of the second layer.

Abstract translation: 一种用于在低温共烧陶瓷（LTCC）衬底中制造多层嵌入式陶瓷电容器的设备。 为了形成多层电极，各个电极层必须电连接。 根据本发明，在第一陶瓷带层上形成多层电容器。 具有开口的第二带层被放置在第一层的顶部上。 第二层中的开口形成为使得暴露的通孔存在于开口的至少两侧以电连接到电极。 当带层被压制和烧制时，暴露的通孔和电极形成公共的电连接。 具有端子通孔的第三层可以放置在第二层的顶部上。

公开(公告)号：US06778058B1

公开(公告)日：2004-08-17

申请号：US10006482

申请日：2001-12-06

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01F500

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/09645 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A method for forming an embedded three-dimensional inductor is provided. Generally, a first coil winding is formed. A first dielectric layer is placed on the first coil winding. At least part of second coil winding is formed on the first dielectric layer and part of the first coil winding to create an electrical contact between the first coil winding and the second coil winding. A first tape layer with a cavity is provided, where the first coil winding, the first dielectric layer, and the second coil winding are within the cavity of the first tape layer.

公开(公告)号：US06470545B1

公开(公告)日：2002-10-29

申请号：US09632361

申请日：2000-08-03

Applicant: Shaul Branchevsky

Inventor： Shaul Branchevsky

IPC: H01G700

CPC classification number: H05K1/162 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/185 ,  H05K3/403 ,  H05K3/4053 ,  H05K2201/09645 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00

Abstract: Embedded green multi-layer ceramic capacitors in low-temperature co-fired ceramic (LTCC) substrates are provided. A first set of electrodes is printed on a ceramic tape. A first dielectric layer is placed over the first set of electrodes and the ceramic tape. A second set of electrodes is printed on the first dielectric layer. A second dielectric layer is placed over the second set of electrodes and the first dielectric layer. A third set of electrodes is printed on the second dielectric layer. The sheet is then cut to form separate green multi-layer ceramic capacitor chips. The green multi-layer ceramic capacitor chips are then placed in a cavity formed by ceramic tape.

Abstract translation: 提供了低温共烧陶瓷（LTCC）基板中的嵌入式绿色多层陶瓷电容器。 第一组电极印在陶瓷胶带上。 将第一电介质层放置在第一组电极和陶瓷带上。 在第一电介质层上印刷第二组电极。 第二介电层放置在第二组电极和第一介电层上。 第三组电极被印刷在第二介电层上。 然后将片材切割成单独的绿色多层陶瓷电容器芯片。 然后将绿色多层陶瓷电容器芯片放置在由陶瓷带形成的空腔中。