发明授权
- 专利标题: Vacuum processing method
- 专利标题(中): 真空加工方法
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申请号: US10006689申请日: 2001-12-10
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公开(公告)号: US06696108B2公开(公告)日: 2004-02-24
- 发明人: Hitoshi Murayama , Toshiyasu Shirasuna , Hiroaki Niino , Makoto Aoki
- 申请人: Hitoshi Murayama , Toshiyasu Shirasuna , Hiroaki Niino , Makoto Aoki
- 优先权: JP2000-377350 20001212; JP2001-359572 20011126
- 主分类号: H05H146
- IPC分类号: H05H146
摘要:
A vacuum processing method comprises placing an article to be processed in a reaction container and simultaneously supplying at least two high-frequency powers having mutually different frequencies to the same high-frequency electrode to generate plasma in the reaction container by the high-frequency powers admitted into the reaction container from the high-frequency electrode so as to process the article to be processed. In the method, at least the high-frequency power having a frequency f1 and the high-frequency power having a frequency f2 are used and satisfy the following two conditions as the high-frequency powers: 250 MHz≧f1>f2≧10 MHz 0.9≧f2/f1≧0.1.
公开/授权文献
- US20020160124A1 Vacuum processing method 公开/授权日:2002-10-31
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