发明授权
- 专利标题: Positive resist laminate
- 专利标题(中): 正抗蚀层压板
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申请号: US09880030申请日: 2001-06-14
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公开(公告)号: US06696219B2公开(公告)日: 2004-02-24
- 发明人: Shoichiro Yasunami , Kenichiro Sato
- 申请人: Shoichiro Yasunami , Kenichiro Sato
- 优先权: JPP.2000-178538 20000614
- 主分类号: G03F711
- IPC分类号: G03F711
摘要:
A positive resist laminate which comprises a substrate, a first resist layer and a second resist layer, wherein the first resist layer is to be a heat-hardening layer and comprises (a-1) a polymer containing an alicyclic skeleton in the side chain thereof, and the second resist layer comprises: (b) a polymer which contains a silicon atom in the side chain thereof and which is insoluble in water and becomes soluble in an aqueous alkali solution by the action of an acid; and (c) a compound which generates an acid upon irradiation with an actinic ray or radiation.
公开/授权文献
- US20020028409A1 Positive resist laminate 公开/授权日:2002-03-07
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