发明授权
- 专利标题: Printed wiring board
- 专利标题(中): 印刷电路板
-
申请号: US09686220申请日: 2000-10-11
-
公开(公告)号: US06703565B1公开(公告)日: 2004-03-09
- 发明人: Masahide Tsukamoto , Masanaru Hasegawa , Hideo Hatanaka
- 申请人: Masahide Tsukamoto , Masanaru Hasegawa , Hideo Hatanaka
- 优先权: JP8-236142 19960906
- 主分类号: H05K102
- IPC分类号: H05K102
摘要:
A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.
信息查询