Invention Grant
- Patent Title: Indirect imaging method for a bonding tool
- Patent Title (中): 粘合工具的间接成像方法
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Application No.: US10075576Application Date: 2002-02-13
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Publication No.: US06712257B2Publication Date: 2004-03-30
- Inventor: David T. Beatson , Christian Hoffman , James E. Eder , John Ditri
- Applicant: David T. Beatson , Christian Hoffman , James E. Eder , John Ditri
- Main IPC: B23K3102
- IPC: B23K3102

Abstract:
A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.
Public/Granted literature
- US20030019911A1 Indirect imaging method for a bonding tool Public/Granted day:2003-01-30
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